Ol Elektroniks we oli printim
Precision Plasma pes Tritmen bilong ol Elektroniks & Fleksibel Divais ol i prinim
Ol plasma pes tritmen i go antap i mekim na ol i ken kisim gutpela pas long ol samting ol i yusim long:
- Ol Fleksibol Printed Seket (FPC){{0} Wokim poliimid (PI) na PET piksa bilong konduktiv ink bonding .
- OLED/LCD Soim - Pre-laminesen tritmen bilong ultra-}pela glas (UTFG) na ITO koting
- Ol Bateri i no gutpela tumas - Ol i bin wokim ol 'electrode foil' long wok bilong ol 'eliectrod foil'
|
Salens |
Solusen bilong Plasma |
Teknikel Benefit |
|
Ol polima bilong eneji antap long pes |
Oksijen/Argon/plasma i kamapim ol haidroksil ({0}}OH) & karboksil ({1}}COOH) grup |
Kontek angle ridaksen long 80 digri →30 digri long<1s |
|
Discharge-sensitiv samting |
Pulsed DBD plasma long<50°C prevents thermal damage |
Nanoskel modifikesen (<10nm depth) only |
|
Adhesen feil long UTFG |
DCSBD plasma i save rausim ol haidrokabon taim yu putim oksijen wok |
10⁵× resistiviti ridaksen long ol rGO seket |
Ol samting bilong helpim ol samting bilong en.
- Ol Film bilong poliimid (Kapton®)
Proses: N₂/H plasma long 20kHz, 7kV
Risal: 60% antap ink adhesen vs. korona tritmen
- Ultra-Long Glas (UTFG)
Proses: Diffuse Koplana pes Baria Discharge (DCSBD)
Risal: 40% konduktiviti i go antap long PEDOT:PSS koting
- Li-on Elektrod Foil
Proses: plasma bilong win wantaim He/O₂ miks
Risal: 15% bikpela strong bilong skin long ol sel i gat lamin.
- Enjinia-Ridim Solusen bilong Discharge-Ol gutpela samting
Ol sistem bilong mipela i bungim ril{0}}}taim impedens monitoring na adaptiv pawa kontrol long stopim ol i ken bung long:
Tempereja-sensitiv bi-}polima (olsem, ol skafold bilong PLGA)
Micro- i bin kisim ol ITO pes
Ol lain i wok long separetim ol bateri
- Kontektim Tim bilong Enjiniaring bilong mipela long:
▶︎ Ripot bilong tes bilong skelim ol samting bilong bodi (incl. WCA/SEM/XPS data)
▶︎ Proses validesen wantaim ol sabstret bilong yu (PI/COP/PEN)
▶︎ Long-sait paramita optimaisesen long stopim bagarap i kamap